Fan-out semiconductor package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJu Hyeon KIM, Doo Hwan LEE
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes: a core member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip. A wall of the through-hole has an uneven portion.
Claims19
A semiconductor package comprising:
- a core member having a through-hole;
- a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface;
- an encapsulant encapsulating at least portions of the semiconductor chip;
- and
- a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip,
- wherein a wall of the through-hole has an uneven portion.
A semiconductor package comprising:
- a core member including an insulating resin, a core material, and a filler, and having a through-hole;
- a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface;
- and
- a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip,
- wherein a portion of wall of the through-hole made of one of the insulating resin, the core material, and the filler has a concave structure with respect to another portion of the wall of the through-hole made of another of the insulating resin, the core material, and the filler.
Dependencies are inferred from the claim text.