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US 2019/0164861 A1Published application
Electronic package and method for fabricating the same
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsWen-Shan Tsai, Chee-Key Chung, Chang-Fu Lin
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Abstract
An electronic package and a method for fabricating the same are provided. The method includes disposing on a carrier an electronic component having a plurality of conductors, encapsulating the electronic component with an encapsulant, and disposing an electronic device on the encapsulant. The electronic device and the carrier are electrically connected through the conductors, thereby reducing the overall thickness of the electronic package.
Claims10
An electronic package, comprising:
- a carrier;
- an electronic component disposed on the carrier and having a first side bonded to the carrier and a second side opposite to the first side;
- a plurality of conductors formed in the electronic component, communicating the first and second sides of the electronic component, and electrically connected to the carrier;
- an encapsulant formed on the carrier and encapsulating the electronic component, with the conductors being partially exposed from the encapsulant;
- and
- an electronic device disposed on the encapsulant and electrically connected to the conductors.
3 more elements
A method for fabricating an electronic package, comprising:
- disposing on a carrier at least an electronic component having a first side bonded to the carrier and a second side opposite to the first side, wherein a plurality of conductors are formed in the electronic component, communicate the first and second sides of the electronic component and are electrically connected to the carrier;
- forming on the carrier an encapsulant for encapsulating the electronic component, with the conductors being partially exposed from the encapsulant;
- and
- disposing on the encapsulant an electronic device electrically connected to the conductors.
1 more element
Dependencies are inferred from the claim text.