Semiconductor apparatus and electric power conversion apparatus

A semiconductor apparatus comprising:

• a base plate;
• a semiconductor device fixed to an upper face of the base plate;
• a casing having a contact lower face in contact with the upper face and a non-contact lower face positioned farther from the semiconductor device than the contact lower face and positioned in an upper part above the contact lower face;
• and
• an adhesive agent in contact with the non-contact lower face and the base plate.

An electric power conversion apparatus, comprising:

• a semiconductor apparatus including a base plate, an adhesive agent provided on an upper face of the base plate, and a casing having a lower face and an inclined face continuous to the lower face and positioned closer to a center of the base plate than the lower face, and fixed to the base plate through the adhesive agent adhering to the lower face and the inclined face, wherein of the adhesive agent, a portion that is in contact with the inclined face is thicker than a portion thereof that is in contact with the lower face,
• a primary converter circuit that includes the semiconductor apparatus and converts and outputs input electric power;
• and
• a control circuit that outputs a control signal for controlling the primary converter circuit to the primary converter circuit.