Semiconductor device and repair operation method thereof

A semiconductor device comprising:

• a plurality of first through-electrodes passing through a first semiconductor chip;
• a plurality of second through-electrodes passing through the first semiconductor chip and arranged alternately adjacent to the first through-electrodes, wherein the first through-electrodes and the second through-electrodes comprise N main through-electrodes and at least one spare through-electrode, where N is a natural number;
• a first signal transmitter suitable for transmitting first output signals of the first semiconductor chip through the main through-electrodes of the first through-electrodes, respectively, and transmitting the Kth to last output signals among the first output signals through the (K+1)th to Nth main through-electrodes and the spare through-electrode, respectively, when the Kth main through-electrode has a defect, among the first through-electrodes, where K is a natural number smaller than or equal to N;
• and
• a second signal transmitter suitable for transmitting second output signals of the first semiconductor chip through the main through-electrodes of the second through-electrodes, respectively, and transmitting the Kth to last output signals among the second output signals through the (K+1)th to Nth main through-electrodes and the spare through-electrode, when the Kth main through-electrode has a defect, among the second through-electrodes.