Test interface board and system including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJONGWOON YOO, DAEHA HWANG, YOUNG-GI MIN, SOOYONG PARK, JONGKOOK KIM
Life of this patent
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Abstract
A test system includes automatic test equipment configured to test a device under test, and a test interface board configured to measure a second voltage applied to the device under test based on a first voltage supplied from the automatic test equipment. The test interface board includes a sensing wiring configured to transmit the measured second voltage to the automatic test equipment. The second voltage is measured at an interior location of the device under test.
Claims23
A test system, comprising:
- an automatic test equipment configured to test a device under test;
- and
- a test interface board configured to measure a second voltage applied to the device under test based on a first voltage supplied from the automatic test equipment,
- wherein the test interface board comprises a sensing wiring configured to transmit the measured second voltage to the automatic test equipment,
- wherein the second voltage is measured at an interior location of the device under test.
A test interface board connected to a device under test, comprising:
- a power plane that receives a first voltage from an automatic test equipment;
- and
- a sensing wiring that measures a second voltage applied to the device under test through the power plane,
- wherein the sensing wiring is connected to an interior location of the device under test.
A semiconductor device, comprising:
- a voltage terminal that receives a driving voltage from a test interface board,
- wherein the semiconductor device is connected to the test interface board, and the test interface board measures an electrical characteristic of the semiconductor device;
- a ground terminal that receives a ground voltage from the test interface board;
- a data terminal that receives data from the test interface board;
- and
- a sensing terminal that measures the driving voltage,
- wherein the sensing terminal is disposed on a surface of the semiconductor device and is connected to a sensing wiring of the test interface board,
- wherein the sensing wiring is connected to a sensing point disposed at an interior location of the semiconductor device, and the driving voltage is measured at the sensing point.
A method of manufacturing a semiconductor device, comprising:
- forming the semiconductor device as part of a wafer or a package;
- and
- testing the semiconductor device, wherein
- the testing of the semiconductor device is performed using an automatic test equipment configured to test the semiconductor device, and a test interface board configured to measure a second voltage applied to the semiconductor device based on a first voltage supplied from the automatic test equipment,
- wherein the test interface board comprises a sensing wiring configured to transmit the measured second voltage to the automatic test equipment, and the second voltage is measured at an interior location of the semiconductor device.
Dependencies are inferred from the claim text.