Conductive Feature Formation and Structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin
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Abstract
Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a barrier layer is formed along a sidewall. A portion of the barrier layer along the sidewall is etched back. After etching back the portion of the barrier layer, an upper portion of the barrier layer along the sidewall is smoothed. A conductive material is formed along the barrier layer and over the smoothed upper portion of the barrier layer.
Claims20
A structure comprising:
- a dielectric layer having a sidewall;
- a barrier layer along the sidewall, an upper surface of the barrier layer being below a top surface of the dielectric layer, a thickness of an upper portion of the barrier layer being less than a thickness of a lower portion of the barrier layer;
- and
- a conductive material along the barrier layer and over the upper surface of the barrier layer, the conductive material having a top surface that is coplanar with the top surface of the dielectric layer.
A structure comprising:
- a dielectric layer having a sidewall;
- an adhesion layer along the sidewall of the dielectric layer, an upper surface of the adhesion layer being lower than a top surface of the dielectric layer;
- a barrier layer along a sidewall of the adhesion layer, the adhesion layer being interposed between the barrier layer and the dielectric layer, an upper surface of the barrier layer being lower than the upper surface of the adhesion layer;
- and
- a conductive material on the barrier layer and over the upper surface of the barrier layer, the conductive material having a top surface that is coplanar with the top surface of the dielectric layer.
A structure comprising:
- a first conductive feature;
- a dielectric layer over the first conductive feature;
- and
- a second conductive feature in the dielectric layer, the second conductive feature comprising:
- an adhesion layer on the first conductive feature;
- a barrier layer on the adhesion layer, the adhesion layer being interposed between the barrier layer and the first conductive feature, an upper surface of the barrier layer being lower than an upper surface of the adhesion layer;
- and
- a conductive material on the barrier layer, the conductive material extending over the upper surface of the adhesion layer and the upper surface of the barrier layer, a top surface of the conductive material being level with a top surface of the dielectric layer.
Dependencies are inferred from the claim text.