Integrated circuit interconnect structure having metal oxide adhesive layer
AssigneeIntel Corporation
InventorShruti Rajeev Jaywant
Life of this patent
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Abstract
Integrated circuit interconnect structures having a metal oxide adhesive layer between conductive interconnects and dielectric material, as well as related apparatuses and methods are disclosed herein. For example, in some embodiments, an integrated circuit interconnect structure may include a dielectric layer having 60% or more filler, a conductive layer, and a metal oxide adhesive layer between the dielectric and conductive layers. In some embodiments, the metal oxide adhesive layer may include one or more of aluminum oxide, chromium oxide, and nickel oxide.
Claims21
-25. (canceled)
A microelectronic assembly, comprising:
- a dielectric layer, wherein the dielectric layer comprises 60% or more filler;
- a conductive layer;
- and
- a metal oxide layer, wherein a thickness of the metal oxide layer is between 4 nanometers and 40 nanometers, and wherein the metal oxide layer is between the dielectric layer and the conductive layer.
An integrated circuit package, comprising:
- a package substrate comprising:
- a dielectric layer, wherein the dielectric layer comprises 60% or more filler;
- a conductive layer;
- and
- a metal oxide layer, wherein a thickness of the metal oxide layer is between 4 nanometers and 40 nanometers, and wherein the metal oxide layer is between the dielectric layer and the conductive layer;
- and
- a die coupled to the package substrate.
A computing device, comprising:
- a package substrate having a first surface and an opposing second surface, the package substrate comprising:
- a dielectric layer, wherein the dielectric layer comprises 60% or more filler;
- a conductive layer;
- and
- a metal oxide layer, wherein a thickness of the metal oxide layer is between 4 nanometers and 40 nanometers, and wherein the metal oxide layer is between the dielectric layer and the conductive layer;
- a circuit board coupled to the first surface of the package substrate;
- and
- a die coupled to the second surface of the package substrate.
Dependencies are inferred from the claim text.