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US 2019/0164807 A1Published application
Electronic package for integrated circuits and related methods
AssigneeTexas Instruments Incorporated
InventorsKurt Peter Wachtler, Anindya Poddar, Usman Mahmood Chaudhry
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Abstract
Electronic packages and related methods are disclosed. An example electronic package apparatus includes a substrate and an electronic component. A protective material is positioned on a first surface, a second surface and all side surfaces of the electronic component to encase the electronic component. An enclosure is coupled to the substrate to cover the protective material and the electronic component.
Claims20
An electronic package apparatus comprising:
- a substrate;
- an electronic component;
- a protective material positioned on a first surface, a second surface and all side surfaces of the electronic component to encase the electronic component;
- and
- an enclosure coupled to the substrate to cover the protective material and the electronic component.
2 more elements
A method, comprising:
- dispensing a first containment mask on an area of a substrate that is to receive an electronic component;
- dispensing a second containment mask on the substrate, the second containment mask to surround the first containment mask;
- applying a first layer of a protective material on the first containment mask, the first containment mask to prevent the first layer of the protective material from flowing outside a perimeter defined by the first containment mask;
- positioning the electronic component on the first layer of the protective material;
- and
- applying a second layer of a protective material on the electronic component, the second containment mask to prevent the second layer of the protective material from flowing outside a perimeter defined by the second containment mask.
3 more elements
An electronic package apparatus including:
- a substrate;
- a first ink residue to provide a first containment mask positioned on a first portion of the substrate;
- a second ink residue to provide a second containment mask positioned on a second portion of the substrate different than the first portion;
- a first layer of a protective material positioned on the first containment mask;
- a die positioned on the first layer of the protective material such that the first layer of the protective material is between the first containment mask and a first surface of the die oriented toward the substrate, the die to be electrically coupled to a pad of the substrate;
- a second layer of the protective material positioned covering portions of the die, the first layer of the protective material and the second layer of the protective material to encapsulate the die, the second containment mask to contain the second layer of the protective material within a perimeter defined by the second containment mask;
- and
- an enclosure coupled to the substrate.
5 more elements
Dependencies are inferred from the claim text.