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US 2019/0164806 A1Published application
Non-embedded silicon bridge chip for multi-chip module
AssigneeInternational Business Machines Corporation
InventorEffendi Leobandung
Life of this patent
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Abstract
A method includes electrically joining two or more semiconductor chips to a silicon bridge chip, and electrically joining the two or more semiconductor chips to a substrate structure, the silicon bridge chip extends into a recess in the substrate structure such that a top surface of the silicon bridge chip is substantially flush with a top surface of the substrate structure.
Claims19
A method comprising:
- electrically joining two or more semiconductor chips to a silicon bridge chip;
- providing a substrate structure comprising a plurality of metal interconnect structures and a plurality of metal layers disposed on an interlevel dielectric;
- forming a recess within the substrate structure, the recess is located in a region of the substrate structure away from the plurality of metal interconnect structures and the plurality of metal layers;
- aligning the silicon bridge chip with the recess;
- and
- electrically joining the silicon bridge chip and the two or more semiconductor chips to the substrate structure, wherein the silicon bridge chip extends into the recess in the substrate structure such that a top surface of the silicon bridge chip is substantially flush with a top surface of the substrate structure.
3 more elements
A method comprising:
- providing two or more semiconductor chips, wherein a first plurality of solder bumps is located on an inner top surface of the two or more semiconductor chips and a second plurality of solder bumps is located on an outer top surface of the two or more semiconductor chips;
- providing a silicon bridge chip;
- providing a substrate structure comprising a plurality of metal interconnect structures and a plurality of metal layers disposed on an interlevel dielectric;
- forming a recess within the substrate structure, the recess is located in a region of the substrate structure away from the plurality of metal interconnect structures and the plurality of metal layers;
- electrically joining the two or more semiconductor chips, using the first plurality of solder bumps, to the silicon bridge chip;
- aligning the silicon bridge chip with the recess;
- electrically joining the silicon bridge chip and the two or more semiconductor chips, using the second plurality of solder bumps, to the substrate structure, wherein the silicon bridge chip extends into the recess in the substrate structure such that a top surface of the silicon bridge chip is substantially flush with a top surface of the substrate structure;
- attaching a lid to the top surface of the substrate structure and a bottom surface of the two or more semiconductor chips;
- and
- forming a third plurality of solder bumps on a bottom surface of the substrate structure.
7 more elements
15-20. (canceled)
Dependencies are inferred from the claim text.