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AssigneeNissan Chemical Corporation
InventorsHiroshi OGINO, Tomoyuki ENOMOTO, Tetsuya SHINJO, Kazuhiro SAWADA, Shunsuke MORIYA
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An adhesive can be easily peeled off after polishing the back face of a wafer, which has heat resistance and can be easily washed off. An adhesive for peelably adhering between a support and a circuit-bearing face of a wafer and thereby processing a back face of the wafer, a peeling face upon peeling becomes selectable according to heating from the support side or wafer side when the adhesive is cured. The adhesive includes a component (A) curing by hydrosilylation reaction and a component (B) containing a polydimethylsiloxane. A peeling method including forming an adhesion layer by applying the adhesive to a surface of a first substrate, bonding a surface of a second substrate to the adhesion layer, curing the adhesion layer by heating from the first substrate side to form a laminate, processing the laminate, and peeling off between the first substrate and the adhesion layer.
An adhesive for peelably adhering between a support and a circuit -bearing face of a wafer and thereby processing a back face of the wafer, a peeling face upon peeling becomes controllable according to heating from the support side or heating from the wafer side when the adhesive is cured.
An adhesive for bonding a surface of a support and a circuit -bearing face of a wafer surface, enabling a temporal adhesion for processing a back face of the wafer, and enabling a selection of a peeling face between the support and the adhesive or between the wafer and the adhesive according to heating and curing from the support side or from the wafer side, wherein the adhesive comprises a component (A) curing by hydrosilylation reaction and a component (B) containing a polydimethylsiloxane.
Dependencies are inferred from the claim text.