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US 2019/0164793 A1Published application
Semiconductor processing stage profiler jig
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsCheng-Kang HU, Hsu-Shui LIU, Jiun-Rong PAI, Shou-Wen KUO, Sheng-Hsiang CHUANG, Cheng-Hung CHEN
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Abstract
In an embodiment, a system includes a profiler configured to detect variations along a surface of a semiconductor stage; and a jig configured to move the profiler along an axis over the semiconductor stage.
Claims20
A system, comprising:
- a profiler configured to detect variations along a surface of a semiconductor stage;
- and
- a jig configured to move the profiler along an axis over the semiconductor stage.
A system, comprising:
- a semiconductor stage, the semiconductor stage configured to receive a semiconductor device for processing, the semiconductor stage configured to rotate;
- a profiler, the profiler configured to detect variations along a surface of the semiconductor stage;
- and
- a jig comprising the profiler, the jig configured to move the profiler along an axis over the semiconductor stage.
1 more element
A method, comprising:
- loading a jig comprising a profiler over a semiconductor processing stage;
- moving the profiler using the jig along an axis over the semiconductor stage, the semiconductor stage configured to receive a semiconductor device for processing;
- detecting variations along a surface of the semiconductor stage using the profiler;
- collecting profiler data as the variations produced by the profiler, the profiler data characterizing the surface of the semiconductor stage;
- and
- performing a remediation to the semiconductor stage based on the profiler data.
3 more elements
Dependencies are inferred from the claim text.