Back to results
US 2019/0164785 A1Published application
Substrate Processing Method and Substrate Processing Apparatus
AssigneeTokyo Electron Limited
InventorYosuke KAWABUCHI
Life of this patent
Estimating the term…
Abstract
There is provided a method of processing a substrate, which includes: forming a liquid film of an organic solvent on a front surface of the substrate; and drying the substrate with the liquid film formed thereon by heating the substrate in a state where a gas density around the substrate is larger than a gas density of air.
Claims6
A method of processing a substrate, comprising:
- forming a liquid film of an organic solvent on a front surface of the substrate;
- and
- drying the substrate with the liquid film formed thereon by heating the substrate in a state where a gas density around the substrate is larger than a gas density of air.
A substrate processing apparatus comprising:
- a forming part configured to form a liquid film of an organic solvent on a front surface of a substrate;
- and
- a drying part configured to dry the substrate with the liquid film formed thereon by heating the substrate in a state where a gas density around the substrate is larger than a gas density of air.
Dependencies are inferred from the claim text.