Die separation using adhesive-layer laser scribing

A method of separating adjacent integrated circuit (IC) dies formed on a semiconductor wafer, the method comprising:

• laser scribing a backside of the wafer along cut-lines located between adjacent ones of the IC dies to create wafer defect regions;
• mounting the laser-scribed wafer onto a substrate using an adhesive layer, wherein the wafer is mounted backside down onto the substrate, and the adhesive layer secures the wafer backside to the substrate;
• laser scribing the adhesive layer to create defect regions in the adhesive layer;
• and
• performing a breaking step to separate the laser-scribed adhesive layer and the laser-scribed wafer into separate adhesive and wafer portions, thereby providing the separated IC dies.

A method of separating adjacent integrated circuit (IC) dies formed on a semiconductor wafer, the method comprising:

• partially cutting a frontside of the wafer along cut-lines located between adjacent ones of the IC dies;
• mounting the partially cut wafer front side down onto a substrate with an adhesive layer between the wafer and the substrate securing the wafer frontside to the substrate;
• grinding a backside of the partially cut wafer to separate the IC dies from each other;
• laser scribing the adhesive layer to form adhesive-layer defect regions;
• and
• performing a breaking step to separate the laser-scribed adhesive layer and the separated IC dies into separate adhesive and IC die portions, thereby providing the separated IC dies.