Semiconductor device package having a multi-portion connection element
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYu-Lin SHIH, Chih Cheng LEE
Life of this patent
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Abstract
A semiconductor substrate includes a dielectric layer, a first patterned conductive layer and a first connection element. The dielectric layer has a first surface. The first patterned conductive layer has a first surface and is disposed adjacent to the first surface of the dielectric layer. The first connection element is disposed on the first surface of the first patterned conductive layer. The first connection element includes a first portion, a second portion and a seed layer disposed between the first portion and the second portion. The first portion of the first connection element and the first patterned conductive layer are formed to be a monolithic structure.
Claims21
A semiconductor substrate, comprising:
- a dielectric layer having a first surface;
- a first patterned conductive layer having a first surface and disposed adjacent to the first surface of the dielectric layer;
- and
- a first connection element disposed on the first surface of the first patterned conductive layer, the first connection element comprising a first portion, a second portion and a seed layer disposed between the first portion and the second portion,
- wherein the first portion of the first connection element and the first patterned conductive layer are formed to be a monolithic structure.
A semiconductor package structure, comprising:
- a substrate, comprising:
- a dielectric layer having a first surface;
- a first patterned conductive layer having a first surface and disposed adjacent to the first surface of the dielectric layer;
- and
- a first connection element disposed on the first surface of the first patterned conductive layer, the first connection element comprising a first portion, a second portion and a seed layer disposed between the first portion and the second portion,
- wherein the first portion of the first connection element and the first patterned conductive layer are formed to be a monolithic structure;
- and
- a first chip having an active surface and disposed on the substrate, wherein the active surface faces the substrate and is electrically connected to the first connection element.
18-22. (canceled)
Dependencies are inferred from the claim text.