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US 2019/0164780 A1Published application
Semiconductor package and method for fabricating base for semiconductor package
AssigneeMedia Tek Inc.
InventorsWen-Sung Hsu, Ta-Jen Yu
Life of this patent
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Abstract
The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.
Claims24
A semiconductor package, comprising:
- a base having a device-attach surface;
- and
- a radio-frequency (RF) device embedded in the base, close to the device-attach surface.
A semiconductor package, comprising:
- a radio-frequency (RF) device, having a bottom surface and a sidewall connected to a base;
- and
- a semiconductor device mounted on the RF device via a conductive structure.
A method for fabricating a base for a semiconductor package, comprising:
- providing a carrier with conductive seed layers on the top surface and the bottom surface of the carrier;
- forming radio-frequency (RF) devices respectively on the conductive seed layers;
- laminating a first base material layer and a second base material layer respectively on the conductive seed layers, covering the RF devices;
- and
- separating the first base material layer the second base material layer, which contain the RF devices thereon, from the carrier to form a first base and a second base.
2 more elements
A method for fabricating a semiconductor package, comprising:
- providing a base;
- forming at least one radio-frequency (RF) device on the base;
- forming an additional insulation material on the base;
- and
- defining patterns upon the additional insulation material, wherein the pattern is formed on the RF device.
2 more elements
Dependencies are inferred from the claim text.