Method for fabricating ingap epitaxial layer by metal organic chemical vapor deposition (mocvd)

A method for fabricating an InGaP epitaxial layer by metal organic chemical vapor deposition (MOCVD), comprising the steps of:

• (A) placing a silicon substrate in a reaction chamber;
• (B) arranging the reaction chamber to have a first chamber temperature, and growing a first GaP layer with a first thickness on the Si substrate at the first chamber temperature;
• (C) arranging the reaction chamber to have a second chamber temperature, and growing a second GaP layer with a second thickness on the first GaP layer at the second chamber temperature, where the second chamber temperature is at least 200° C. higher than the first chamber temperature and the second thickness is 80-180 times of the first thickness;
• (D) arranging the reaction chamber to have a third chamber temperature for a first time interval, and then arranging the reaction chamber to have a fourth chamber temperature for a second time interval, in which the fourth chamber temperature is higher than the second chamber temperature, the third chamber temperature is at least 0.5 time of the fourth chamber temperature, and the second time interval is at least 8 times of the first time interval;
• and
• (E) growing a multi-layered InGaP layer on the second GaP layer
• wherein the third chamber temperature is 390-420° C., the first time interval is 25-35 sec, the fourth chamber temperature is 780-840° C., the second time interval is 5-10 min, and the temperature of the reaction chamber is adjusted from the third chamber temperature to the fourth chamber temperature at a ramping rate of 0.8-1.2° C./sec.