Blocking Structures on Isolation Structures

A method of fabricating a semiconductor device comprising:

• forming a first isolation structure into a semiconductor substrate so that the isolation structure circumscribes a portion of the semiconductor substrate;
• forming a second isolation structure within the portion of the semiconductor substrate so that the second isolation structure circumscribes a sub-portion of the semiconductor substrate;
• forming a blocking structure over the first isolation structure, the blocking structure having a lower reflectivity than the first isolation structure;
• and
• forming a patterned photoresist layer over the semiconductor substrate such that the patterned photoresist layer covers the sub-portion while exposing remaining regions of the portion.

A method for fabricating a semiconductor device, the method comprising:

• providing a semiconductor substrate;
• forming, within the substrate, an isolation structure that is sized and shaped to isolate a two-dimensional array of separated portions of the semiconductor substrate;
• forming a plurality of blocking structures positioned over the isolation structure such that each of the separated portions of the semiconductor substrate are surrounded by the blocking structures, the blocking structures having a lower reflectivity than the isolation structure;
• and
• forming semiconductor devices formed within the separated portions.