Novel gas injector

A plasma processing system, comprising:

• a gas delivery system configured to provide at least one gas;
• a semiconductor processing chamber coupled to the gas delivery system;
• a gas injector configured to couple the gas delivery system and the semiconductor processing chamber, wherein the gas injector comprises a tube and at least one nozzle head mounted on a downstream end of the tube wherein the at least one nozzle allows a fluid communication to discharge a gas from a upstream end of the tube through the at least one nozzle of the gas injector to ambient atmosphere surrounding the downstream end of the tube, wherein the at least one nozzle comprises:
• a body, and at least one adaptor, wherein the adaptor comprises a plurality of flow regulation components to alter a flow direction of the gas at the downstream end, wherein the plurality of flow regulation components are arranged such that a film buildup on inner surfaces of the gas injector is reduced.

A plasma processing method, comprising:

• processing a plurality of semiconductor wafers in a semiconductor processing reaction chamber;
• altering a flow of gas within a gas injector so that the gas travels in a plurality of directions so as to reduce a film buildup on at least one inner surface of the gas injector;
• and
• performing a plasma-enhanced semiconductor process to clean a film buildup formed on the semiconductor processing reaction chamber and the gas injector.