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US 2019/0164698 A1Published application
Multi-layer ceramic electronic component, method of producing the same, and ceramic body
AssigneeTaiyo Yuden Co., Ltd.
InventorsYoichi Kato, Kotaro Mizuno, Yukihiro Konishi
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Abstract
A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer sheet including laminated ceramic sheets, and internal electrodes disposed between the ceramic sheets; cutting the multi-layer sheet to produce multi-layer chips each having side surfaces from which the internal electrodes are exposed; smoothing the side surfaces of the multi-layer chips; and providing side margins to the smoothed side surfaces of the multi-layer chips.
Claims4
A ceramic body for producing a multi-layer ceramic electronic component, the ceramic body being unsintered and comprising:
- a multi-layer chip including
- laminated ceramic layers,
- internal electrodes disposed between the ceramic layers, and
- side surfaces from which the internal electrodes are exposed;
- and
- side margins provided to the side surfaces of the multi-layer chip,
- the side surfaces of the multi-layer chip each have an irregularity height that is 20% or less of a thickness of the side margins.
4 more elements
Dependencies are inferred from the claim text.