Composite electronic component, method of manufacturing the same, board for mounting thereof, and packaging unit thereof

A composite electronic component comprising:

• a composite body including a capacitor and an ESD protection device coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and a plurality of first and second internal electrodes are stacked with a respective dielectric layer interposed between the first and second internal electrodes, and the ESD protection device including a substrate, first and second electrodes disposed below the substrate and insulated from each other, a discharging part disposed between the first and second electrodes, and a protective layer disposed below the first and second electrodes and the discharging part to substantially cover the entirety of upper surfaces of the first and second electrodes and the discharging part;
• a first external electrode disposed on a first end surface of the ceramic body in a length direction of the ceramic body and connected to the first internal electrodes of the capacitor and a second external electrode disposed on a second end surface of the ceramic body in the length direction and connected to the second internal electrodes of the capacitor;
• and
• a third external electrode disposed on a first end surface of the ESD protection device in the length direction, partially disposed on a surface of the protective layer in a thickness direction, and connected to the first electrode and a fourth external electrode disposed on a second end surface of the ESD protection device in the length direction, partially disposed on a surface of the protective layer in a thickness direction, and connected to the second electrode,
• wherein the composite body includes an input terminal including the first and third external electrodes coupled to each other and a ground terminal including the second and fourth external electrodes coupled to each other, the capacitor and the ESD protection device are coupled to each other by a conductive adhesive, and plating layers are disposed on outer portions of the input terminal and the ground terminal,
• wherein the protective layer is exposed to the first and the second end surfaces of the ceramic body.

A composite electronic component comprising:

• a composite body in which a noise filter unit and an ESD protection device disposed below the noise filter unit are coupled to each other;
• and
• an input terminal and a ground terminal coupled to the composite body and each partially disposed on a surface of the ESD protection device in a thickness direction,
• wherein the noise filter unit is configured to filter a noise component of an input signal input to the input terminal, and the ESD protection device bypasses an over-voltage input beyond a rated voltage applied to the input terminal;
• wherein the ESD protection device includes a discharging part disposed between the first and second electrodes, and a protective layer disposed below the first and second electrodes and the discharging part to substantially cover the entirety of upper surfaces of the first and second electrodes and the discharging part,
• wherein the protective layer is exposed to the first and the second end surfaces of the ceramic body.

A method of manufacturing a composite electronic component, comprising:

• preparing a capacitor including a ceramic body in which a plurality of dielectric layers and internal electrodes are stacked with a respective dielectric layer interposed between the internal electrodes;
• forming first and second electrodes on the ceramic body so as to be insulated from each other;
• applying a paste containing a conductive polymer between the first and second electrodes to prepare a discharging part;
• applying an insulating resin onto the first and second electrodes and the discharging part to prepare an ESD protection device;
• and
• forming an input terminal and a ground terminal on both end surfaces of a composite body in a length direction of the composite body, respectively, and partially disposed on a surface of the insulating resin in a thickness direction, the composite body being formed by coupling to each other the capacitor including the ceramic body and the ESD protection device formed on the ceramic body,
• wherein the discharging part is formed such that it is between the first and second electrodes, and the insulating resin is applied onto the first and second electrodes and the discharging part to substantially cover the entirety of upper surfaces of the first and second electrodes and the discharging part,
• wherein the insulating resin is exposed to a first and a second end surfaces of the ceramic body.

A composite electronic component comprising:

• a capacitor having a body in which are located internal electrodes separated by dielectric material;
• an electrostatic discharge (ESD) protection device disposed on the body of the capacitor and having first and second electrodes coupled to the internal electrodes of the capacitor, the ESD having a discharge part between first and second electrodes at opposite portions of the discharge part, and a protective layer disposed below the first and second electrodes and the discharging part to substantially cover the entirety of upper surfaces of the first and second electrodes and the discharging part;
• and
• input and ground terminals coupled to the first and second electrodes of the ESD and partially disposed on a surface of the ESD in a thickness direction,
• wherein the protective layer is exposed to a first and a second end surfaces of the body.