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US 2019/0164672 A1Published application
Chip resistor and paste for forming resist layer of chip resistor
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJang-Seok YUN
Life of this patent
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Abstract
A paste for forming a resist layer of a resistor includes: a copper-based alloy powder; and nickel (Ni) powder in an amount greater than 0 wt % of the copper-based alloy powder and less than or equal to 10 wt % of the copper-based alloy powder, wherein the paste is glass-free.
Claims13
A paste for forming a resist layer of a resistor, comprising:
- a copper-based alloy powder;
- and
- a nickel (Ni) powder in an amount greater than 0 wt % of the copper-based alloy powder and less than or equal to 10 wt % of the copper-based alloy powder,
- wherein the paste is glass-free.
1 more element
A chip resistor, comprising:
- a substrate;
- a first electrode disposed on a surface of the substrate;
- a second electrode disposed on the surface of the substrate such that the second electrode is separated from the first electrode;
- a resist layer disposed on the surface of the substrate so as to connect the first electrode and the second electrode to each other;
- and
- a protective layer disposed on a surface of the resist layer so as to protect the resist layer,
- wherein the resist layer comprises a copper-based alloy, and nickel (Ni) in an amount greater than 0 wt % of the copper-based alloy and less than or equal to 10 wt % of the copper-based alloy, and
- wherein the resist layer is glass-free.
5 more elements
Dependencies are inferred from the claim text.