Semiconductor chip module and semiconductor package including the same

A semiconductor package comprising:

• a substrate including a top surface, a bottom surface, an opening which passes through the top surface and the bottom surface, and coupling pads formed over the bottom surface;
• a semiconductor chip module including a chip unit including first and second semiconductor chips formed over a single body to be adjacent in a first direction with a scribe line region interposed therebetween, and having a first surface over which bonding pads of the first and second semiconductor chips are positioned and a second surface which faces away from the first surface, a plurality of oblique redistribution lines formed over the first surface, having one set of ends which are respectively electrically coupled to the bonding pads of the first and second semiconductor chips, and extending toward the scribe line region, and a plurality of redistribution pads disposed over the first surface, and electrically coupled with another set of ends of the oblique redistribution lines which face away from the one set of ends, the semiconductor chip module being disposed over the substrate such that the redistribution pads are exposed through the opening;
• and
• conductive coupling members electrically coupling the redistribution pads and the coupling pads through the opening,
• the redistribution pads comprising:
• one or more shared redistribution pads electrically coupled in common to one or more of the oblique redistribution lines electrically coupled to the bonding pads of the first semiconductor chip and one or more of the oblique redistribution lines electrically coupled to the bonding pads of the second semiconductor chip;
• and
• a plurality of individual redistribution pads individually electrically coupled to the oblique redistribution lines which are not electrically coupled with the shared redistribution pads,
• wherein the bonding pads are arranged along a second direction perpendicular to the first direction,
• wherein the first and second semiconductor chips are electrically connected each other through the shared redistribution pads and the oblique redistribution lines electrically coupled to the shared redistribution pads,
• the oblique redistribution lines are inclined with respective to the first direction.