Method and system for diagnosing a semiconductor wafer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYen-Liang CHEN, Jun-Xiu LIU
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Abstract
Methods and systems for diagnosing a semiconductor wafer are provided. A first raw image, a second raw image, and a third raw image of the semiconductor wafer are obtained by an inspection apparatus according to graphic data system (GDS) information regarding layout of a target die. A first image-based comparison is performed by a determining circuitry on the first, second, and third raw images, so as to provide a comparison result. The comparison result indicates whether an image difference is present between the first, second, and third raw images.
Claims20
A method for diagnosing a semiconductor wafer, comprising:
- obtaining a first raw image, a second raw image, and a third raw image of the semiconductor wafer according to graphic data system (GDS) information regarding a layout of a target die, by an inspection apparatus;
- and
- performing a first image-based comparison on the first, second and third raw images, so as to provide a comparison result, by a determining circuitry,
- wherein the comparison result indicates whether an image difference is present between the first, second, and third raw images.
A method for diagnosing a semiconductor wafer, comprising:
- obtaining, using an inspection apparatus, a plurality of raw images from a plurality of positions of the semiconductor wafer, respectively;
- performing, using a determining circuitry, a first image-based comparison on the plurality of raw images, so as to detect whether an image difference is present between the plurality of raw images;
- assigning the raw image having the image difference as a defect image;
- and
- performing, using the determining circuitry, a second image-based comparison on a reference image and the defect image, so as to classify a defect type of the image difference.
A system for diagnosing a semiconductor wafer, comprising:
- a processing circuitry configured to provide graphic data system (GDS) information of layout of a target die;
- an inspection apparatus configured to obtain a first raw image, a second raw image, and a third raw image from the semiconductor wafer according to the GDS information from the processing circuitry;
- and
- a determining circuitry configured to receive the first, second, and third raw images from the inspection apparatus, and to perform a first image-based comparison on the first, second, and third raw images to detect whether an image difference is present between the first, second, and third raw images.
Dependencies are inferred from the claim text.