Fan-out sensor package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJu Ho KIM, Eun Sil KIM, Sang Kyu LEE, Jong Man KIM, Seok Hwan KIM
Life of this patent
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Abstract
A fan-out sensor package includes: a core member including a wiring layer including a plurality of layers and having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole; an encapsulant encapsulating at least portions of the core member and the IC for a sensor; and a connection member disposed on the core member and the IC for a sensor and including a plurality of circuit layers, wherein the circuit layer includes sensing patterns detecting a change in capacitance.
Claims22
A fan-out sensor package comprising:
- a core member including a wiring layer including a plurality of layers and having a through-hole;
- an integrated circuit (IC) for a sensor disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface;
- a passive component disposed side-by-side with the IC for a sensor in the through-hole and having external electrodes;
- an encapsulant covering at least portions of the core member, the inactive surface of the IC for a sensor, and the passive component and filling at least portions of the through-hole;
- and
- a connection member disposed on the core member, the active surface of the IC for a sensor, and the passive component and including a circuit layer including a plurality of layers,
- wherein the circuit layer is electrically connected to the wiring layer, the connection pads, and the external electrodes, and
- the circuit layer includes sensing patterns detecting a change in capacitance.
A fan-out sensor package comprising:
- a core member including an insulating layer, a first wiring layer disposed on an upper surface of the insulating layer, a second wiring layer disposed on a lower surface of the insulating layer, and vias penetrating through the insulating layer and electrically connecting the first and second wiring layers to each other and having a through-hole;
- an IC for a sensor disposed in the through-hole;
- an encapsulant covering at least portions of the core member and a lower surface of the IC for sensor and filling at least portions of the through-hole;
- and
- a connection member disposed on the core member and an upper surface of the IC for a sensor and including a plurality of conductive layers,
- wherein the first wiring layer and the connection member face each other, and the second wiring layer has a thickness greater than that of the first wiring layer.
Dependencies are inferred from the claim text.