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US 2019/0163939 A1Published application
Rfid tag and rfid system
AssigneeKYOCERA Corporation
InventorsShuuichi YAMAMOTO, Kensou OCHIAI
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Abstract
An RFID tag in the present disclosure includes an insulating substrate including an upper surface, a coil conductor disposed in the insulating substrate, a semiconductor element mounted on the upper surface of the insulating substrate, and a mold resin covering the upper surface of the insulating substrate and the semiconductor element. The mold resin contains a plurality of magnetic particles having particle sizes different from each other.
Claims20
An RFID tag comprising:
- an insulating substrate with an upper surface;
- a coil conductor in the insulating substrate;
- a semiconductor element on the upper surface of the insulating substrate;
- and
- a mold resin covering the upper surface of the insulating substrate and the semiconductor element, wherein
- the mold resin contains a plurality of magnetic particles having particle sizes different from each other.
3 more elements
Dependencies are inferred from the claim text.