Method and apparatus for simulating flexible panel
AssigneeBoe Technology Group Co., Ltd.
InventorsXixi Guo, Shang Chieh Chu, Shiming Shi
Life of this patent
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Abstract
The embodiments of the present disclosure provide a method and apparatus for simulating a flexible panel. The method comprises: establishing a geometric model of the flexible panel; cutting a layer adjacent to a layer where a wiring region is located in the geometric model of the flexible panel; partitioning the following regions or layers in the cut geometric model into grid cells: the wiring region, layers other than the layer where the wiring region located and the layer adjacent to the layer where the wiring region is located, and regions obtained by cutting the layer adjacent to the layer where the wiring region is located; and simulating the flexible panel based on the partition.
Claims20
A method for simulating a flexible panel, comprising:
- establishing a geometric model of the flexible panel;
- cutting a layer adjacent to a layer where a wiring region is located in the geometric model of the flexible panel;
- partitioning the following regions or layers in the cut geometric model into grid cells:
- the wiring region, layers other than the layer where the wiring region located and the layer adjacent to the layer where the wiring region is located, and regions obtained by cutting the layer adjacent to the layer where the wiring region is located;
- and
- simulating the flexible panel based on the partition.
An apparatus for simulating a flexible panel, comprising:
- a model establishment module configured to establish a geometric model of the flexible panel;
- a cutting module configured to cut a layer adjacent to a layer where a wiring region is located in the geometric model of the flexible panel;
- a partition module configured to partition the following regions or layers in the cut geometric model into grid cells:
- the wiring region, layers other than the layer where the wiring region located and the layer adjacent to the layer where the wiring region is located, and regions obtained by cutting the layer adjacent to the layer where the wiring region is located;
- and
- an analysis module configured to simulate the flexible panel based on the partition.
Dependencies are inferred from the claim text.