US 2019/0163309 A1 · POSITION AND MAGNETIC FIELD SENSORS

Abstract

Systems and methods which provide a semiconductor with thin metallic film deposition sensor configuration are described. Thin metallic film semiconductor sensors of embodiments may be utilized in determining various impingements upon the sensor surface, such as from objects touching, hovering near, or light sources illuminating a sensor surface. Embodiments of a thin metallic film deposition semiconductor sensor provide a non-resistive, non-capacitive sensor configuration operable for determining position of various objects, including both electrically conductive objects and non-electrically conductive objects. A semiconductor with thin metallic film sensor of embodiments may additionally or alternatively provide a magnetic field sensor configuration operable for determining magnitude and/or direction with respect to a magnetic field.

Claims26

Dependent claims

A sensor comprising:

a semiconductor substrate;
a metallic film deposited on a surface of the semiconductor substrate, wherein the metallic film forms a sensor surface of the sensor;
a first pair of electrical contacts disposed equidistant from a datum point of the sensor surface and along a first axis, wherein the first pair of electrical contacts are configured to provide a first axis component of difference of potential information regarding impingement sensed by the sensor;
and
a second pair of electrical contacts disposed equidistant from the datum point of the sensor surface and along a second axis, wherein the first and second axes are orthogonal, wherein the second pair of electrical contacts are configured to provide a second axis component of difference of potential information regarding impingement sensed by the sensor.

2 more elements

A system for sensing impingement on a sensor surface of a sensor, the system comprising:

a sensor assembly comprising:
a semiconductor substrate;
a metallic film deposited on a surface of the semiconductor substrate, wherein the metallic film forms a sensor surface of the sensor;
a first pair of electrical contacts disposed equidistant from a datum point of the sensor surface and along a first axis, wherein the first pair of electrical contacts are configured to provide a first axis component of difference of potential information regarding impingement sensed by the sensor;
and
a second pair of electrical contacts disposed equidistant from the datum point of the sensor surface and along a second axis, wherein the first and second axes are orthogonal, wherein the second pair of electrical contacts are configured to provide a second axis component of difference of potential information regarding impingement sensed by the sensor;
one or more potential difference measurement circuits coupled to the first pair of electrical contacts and the second pair of electrical contacts and configured to determine a difference of potential (ΔV1) for the first pair of electrical contacts and a difference of potential (ΔV2) for the second pair of electrical contacts;
and
impingement attribute determination logic coupled to the one or more potential difference measurement circuits and configured to obtain the difference of potential (ΔV1) for the first pair of electrical contacts and the difference of potential (ΔV2) for the second pair of electrical contacts and determine one or more attributes of the impingement therefrom.

6 more elements

Dependencies are inferred from the claim text.

Position and magnetic field sensors

Life of this patent

Position and magnetic field sensors

Life of this patent

Abstract

Claims26