Wiring body, wiring board, touch sensor, and manufacturing method of wiring body
AssigneeFujikura Ltd.
InventorTakeshi Shiojiri
Life of this patent
Estimating the term…
Abstract
A wiring body includes a main body portion including a first layered portion. The first layered portion includes a resin portion and a conductor portion disposed on the resin portion. The wiring body further includes an overcoat portion disposed on the main body portion and that covers the conductor portion. Surface roughness of a first main surface of the main body portion is greater than surface roughness of a second main surface of the overcoat portion. The first main surface is on a side opposite to the overcoat portion, and the second main surface is on a side opposite to the main body portion.
Claims10
A wiring body comprising:
- a main body portion comprising a first layered portion, wherein the first layered portion comprises:
- a resin portion;
- and
- a conductor portion disposed on the resin portion;
- and
- an overcoat portion disposed on the main body portion and that covers the conductor portion,
- wherein surface roughness of a first main surface of the main body portion is greater than surface roughness of a second main surface of the overcoat portion,
- the first main surface is on a side opposite to the overcoat portion, and
- the second main surface is on a side opposite to the main body portion.
A manufacturing method of a wiring body comprising:
- curing a conductive material filling in a concave portion of an intaglio;
- pressing a first board against the intaglio through a first resin material;
- curing the first resin material;
- a integrally releasing an intermediate containing the conductive material and the first resin material, and the first substrate from the intaglio;
- pressing a second substrate against the intermediate from a side opposite to the first substrate in the intermediate through a second resin material;
- curing the second resin material;
- and
- releasing the first substrate from the intermediate and of releasing the second substrate from the second resin material,
- wherein surface roughness of a third main surface of the first board is greater than surface roughness of a fourth main surface of the second board,
- the third main surface is on a side facing the intermediate, and
- the fourth main surface is on a side facing the second resin material.
Dependencies are inferred from the claim text.