Heater and heating apparatus
AssigneesToshiba Tec Kabushiki Kaisha, Toshiba Hokuto Electronics Corporation
InventorOsamu TAKAGI
Life of this patent
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Abstract
A heater includes an insulating substrate, a heat generating section formed in the insulating substrate and including a plurality of divided regions in a longitudinal direction, temperature sensors detecting temperature of the heat generating section and a wiring pattern for power feed to the temperature sensors, each formed in a layer different from a layer in which the heat generating section is formed in the insulating substrate. The heat generating section, the temperature sensors, and the wiring pattern are layer stacked.
Claims18
A heater comprising:
- a multilayer structure including first and second insulating substrates and an interlayer insulating substrate between the first and second insulating substrates;
- a plurality of heat generating members on the first insulating substrate;
- a plurality of sensors on the second insulating substrate, detecting temperatures of the heat generating members;
- a first wiring pattern on the interlayer insulating substrate, for supplying power to the heat generating members;
- and
- a second wiring pattern on the second insulating substrate, for supplying power to the sensors.
A heating apparatus comprising:
- an endless belt;
- a heater opposed to a conveyed sheet via the endless belt;
- and
- a pressurizing body set in a position opposed to the heater across the endless belt, wherein
- the heater comprises:
- a multilayer structure including first and second insulating substrates and an interlayer insulating substrate between the first and second insulating substrates;
- a plurality of heat generating members on the first insulating substrate;
- a plurality of sensors on the second insulating substrate, detecting temperatures of the respective heat generating members;
- a first wiring pattern on the interlayer insulating substrate, for supplying power to the heat generating members;
- and
- a second wiring pattern on the second insulating substrate, for supplying power to the sensors.
Dependencies are inferred from the claim text.