Photosensitive resin composition and cured film prepared therefrom

Abstract

The present invention relates to a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition additionally includes a thermal acid generator in addition to a conventional siloxane polymer, and an 1,2-quinonediazide compound, and a hydrogen bond between the diazonaphthoquinone group (DNQ) of the quinonediazide compound and the siloxane polymer may be cleaved by an acid generated from the thermal acid generator even if a photobleaching process is not performed during the preparation of a cured film. Accordingly, when the photosensitive resin composition is used a cured film having high transmittance and high resolution may be provided efficiently without any restrictions on a process equipment. In addition, the increase of the transmittance of the cured film may be maximized when acid groups generated from the thermal acid generator is a strong acid having a pKa value of −5 or less.

Dependencies are inferred from the claim text.