Extreme ultraviolet (euv) mask for lithography and associated methods
AssigneeSamsung Electronics Co., Ltd.
InventorsWoon-hyuk CHOI, No-young CHUNG
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AssigneeSamsung Electronics Co., Ltd.
InventorsWoon-hyuk CHOI, No-young CHUNG
Estimating the term…
A method of manufacturing an extreme ultraviolet (EUV) mask, for use in an EUV exposure process, on a mask substrate includes constructing a first monitoring macro considering an effect caused by a slit used in the EUV exposure process, performing an optical proximity correction (OPC) using a plurality of second monitoring macros, wherein each of the plurality of second monitoring macros is substantially identical to the first monitoring macro, inputting mask tape-out (MTO) design data acquired through the OPC, preparing mask data including at least one of data format conversion, mask process correction (MPC), and job-deck for the MTO design data, and performing EUV exposure (writing) on the mask substrate based on the mask data.
A method of manufacturing an extreme ultraviolet (EUV) mask, for use in an EUV exposure process, on a mask substrate, the method comprising:
A method of providing a monitoring macro, the method comprising:
An optical proximity correction (OPC) method, the method comprising:
Dependencies are inferred from the claim text.