Hybrid Interconnect Device and Method

A method comprising:

• patterning a portion of a substrate to form a waveguide, the substrate having a first surface and a second surface opposite the first surface;
• depositing a first dielectric layer on the waveguide and the first surface of the substrate;
• forming vias extending through the first dielectric layer;
• depositing a plurality of second dielectric layers on the first dielectric layer;
• forming a plurality of conductive features in the second dielectric layers, a first region of the second dielectric layers being free from the conductive features;
• attaching a plurality of dies to the second dielectric layers, the dies being electrically connected to the conductive features, the dies being optically connected to the waveguide through the first region of the second dielectric layers;
• thinning the second surface of the substrate to expose the vias;
• and
• forming conductive connectors electrically connected to the vias.

A method comprising:

• depositing a first dielectric layer around waveguides, the waveguides being formed of a first material having a first refractive index, the first dielectric layer being formed of a second material having a second refractive index less than the first refractive index;
• forming a plurality of vias from a first side of the first dielectric layer to a second side of the first dielectric layer;
• depositing a plurality of second dielectric layers on the first side of the first dielectric layer, the second dielectric layers being formed of the second material;
• forming a plurality of conductive features in the second dielectric layers;
• bonding a plurality of dies to the conductive features, the dies being electrically connected by the conductive features, the dies being optically connected by the waveguides;
• and
• forming a plurality of conductive connectors on the second side of the first dielectric layer, the conductive connectors being electrically connected to the dies by the conductive features and the vias.

A method comprising:

• depositing a first dielectric layer around a waveguide, the first dielectric layer having a first side and a second side opposite the first side, the waveguide comprising a material having a first refractive index, the first dielectric layer comprising a material having a second refractive index;
• forming a plurality of vias extending from the first side of the first dielectric layer to the second side of the first dielectric layer;
• depositing a plurality of second dielectric layers adjacent the first side of the first dielectric layer, the second dielectric layers comprising a material having a third refractive index, the second refractive index and the third refractive index being less than the first refractive index;
• forming a plurality of first conductive features in first regions of the second dielectric layers, second regions of the second dielectric layers being free from the first conductive features;
• and
• forming a plurality of second conductive features adjacent the second side of the first dielectric layer, the vias electrically connecting the second conductive features to the first conductive features.