Backlight assembly, display device including the same, and methods of fabricating the backlight assembly and the display device
AssigneeSamsung Display Co., Ltd.
InventorJUNGHOON SHIN
Life of this patent
Estimating the term…
Abstract
A backlight assembly includes a light guide plate that includes an incidence surface and a light source unit that emits light through a light emitting surface toward the incidence surface. The light source unit includes a light source and a circuit board that are electrically connected to each other. The light source is disposed on the circuit board, and the circuit board is electrically connected to the light source and extends in a first direction. At least a portion of the light guide plate contacts the circuit board at a contact surface that extends along a first direction. A portion of the contact surface is used as a bonding region.
Claims20
A backlight assembly, comprising:
- a light guide plate that includes an incidence surface;
- and
- a light source unit that emits light through a light emitting surface toward the incidence surface;
- wherein the light source unit comprises a light source and a circuit board that are electrically connected to each other,
- the light source is disposed on the circuit board,
- the circuit board extends in a first direction,
- at least a portion of the light guide plate contacts the circuit hoard at a contact surface that extends along the first direction, and
- a bonding region is disposed on the contact surface.
A display device, comprising:
- a light guide plate that includes an incidence surface;
- and
- a light source unit that emits light to the incidence surface,
- wherein the light source unit comprises a light source and a circuit board that are electrically connected to each other, the light source is mounted on the circuit board,
- at least a portion of the light guide plate is in contact with the circuit board;
- and
- a bonding region is formed where the portion of the light guide plate contacts the circuit board, wherein
- the bonding region is formed of a mixed material comprising a material from the circuit board and a material from the light guide plate.
A method of fabricating a backlight assembly, comprising:
- providing a circuit board;
- providing a light source unit on the circuit board;
- providing a light guide plate on the circuit board adjacent to the light source unit;
- and
- forming a bonding region between the light guide plate and the circuit board using a laser beam.
Dependencies are inferred from the claim text.