Multilayer wiring board for inspection of electronic components

Abstract

Provided is a multilayer wiring board for inspection of electronic components which has excellent reliability by improving the adhesiveness between a resin wiring portion and a ceramic wiring substrate. A multilayer wiring board 10 according to the present invention includes: a ceramic wiring substrate 20 having a substrate main surface 21 and a substrate rear surface 22; substrate-side conductive layers 32, 33 formed on the substrate main surface 21; and a resin wiring portion 40 stacked on the substrate main surface 21 so as to cover the substrate-side conductive layers 32, 33. Inspection pads 50, 51 for inspection of electronic components are formed on a front surface 49 of the resin wiring portion 40. End surfaces of the substrate-side conductive layers 33 are exposed from side surfaces 13 of the multilayer wiring board 10. An outer peripheral edge of a rear surface of the resin wiring portion 40 is in contact with the surfaces of the substrate-side conductive layers 33, and end surfaces of the resin wiring portion 40 and the end surfaces of the substrate-side conductive layers 33 are positioned closer to the center of the board than end surfaces 23 of the ceramic wiring substrate 20.

Dependencies are inferred from the claim text.