Apparatus for testing a signal speed of a semiconductor package and method of manufacturing a semiconductor package

An apparatus for testing a signal speed of a semiconductor package, the apparatus comprising:

• a plurality of sockets each including a latch configured to fix the semiconductor package;
• one or more test boards including at least a first test board including a plurality of mount regions configured to receive the sockets, and test lines extended from the mount regions toward at least one side surface of the mount regions;
• an extension board vertically arranged at the side surface of the first test board and electrically connected to the test lines;
• and
• a test head electrically connected to the extension board to provide the mount regions with a test signal for testing the signal speed of the semiconductor package through the extension board.

An apparatus for testing a signal speed of a semiconductor package, the apparatus comprising:

• a plurality of sockets each including a latch configured to fix the semiconductor package;
• a plurality of test boards including a plurality of mount regions configured to receive the sockets, and test lines extended from the mount regions toward at least one side surface of the mount regions;
• connectors arranged at the side surfaces of the test boards and connected to the test board to the test lines;
• an extension board vertically arranged at the side surface of each of the test boards and electrically connected to the connectors;
• a test head electrically connected to the extension board to provide the mount regions with a test signal for testing the signal speed of the semiconductor package through the extension board;
• and
• a coupling member configured to selectively connect the extension board to the test head.