Sensor device and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen Hsiung YANG, Chun-Wen CHENG, Jiou-Kang LEE
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Abstract
A sensor device includes a microelectromechanical system (MEMS) force sensor, and a capacitive acceleration sensor. In the method of manufacturing the sensor device, a sensor portion of the MEMS force sensor is prepared over a front surface of a first substrate. The sensor portion includes a piezo-resistive element and a front electrode. A bottom electrode and a first electrode are formed on a back surface of the first substrate. A second substrate having an electrode pad and a second electrode to the bottom of the first substrate are attached such that the bottom electrode is connected to the electrode pad and the first electrode faces the second electrode with a space therebetween.
Claims20
A sensor device, comprising:
- a microelectromechanical system (MEMS) force sensor including a membrane;
- and
- a capacitive acceleration sensor including a capacitor having a first electrode,
- wherein the first electrode is disposed on a bottom face of the membrane.
A method of manufacturing a sensor device, the method comprising:
- preparing a sensor portion of a microelectromechanical system (MEMS) force sensor over a front surface of a first substrate, the sensor portion including a piezo-resistive element and a front electrode;
- forming a bottom electrode and a first electrode on a back surface of the first substrate;
- and
- attaching a second substrate having an electrode pad and a second electrode to a bottom of the first substrate such that the bottom electrode is connected to the electrode pad and the first electrode faces the second electrode with a space therebetween.
A method of manufacturing a sensor device, the method comprising:
- preparing a microelectromechanical system (MEMS) sensor, the MEMS sensor including:
- a frame portion;
- a membrane portion;
- a piezo-resistive element disposed in the membrane portion;
- a cavity disposed below the membrane portion and surrounded by the frame portion;
- and
- a center weight portion surrounded by the cavity, wherein a bottom electrode is formed on a bottom of the frame portion and a first electrode is formed on a bottom of the center weight portion;
- preparing a part of a capacitive sensor including a substrate, a second electrode disposed on a main surface of the substrate and an electrode pad disposed on the main surface;
- and
- attaching the MEMS sensor and the part of the capacitive sensor such that the bottom electrode is connected to the electrode pad and the first electrode faces the second electrode with a space therebetween, thereby forming a capacitor of the capacitive sensor.
Dependencies are inferred from the claim text.