Broadband wafer defect detection
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsNai-Han CHENG, Hsing-Piao HSU
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Abstract
In an embodiment, a system includes: a broadband light source; a wafer with a first side facing the broadband light source; a first light sensor configured to detect reflected light from the broadband light source emanating from the first side; a second light sensor configured to detect emergent light emanating from a second side of the wafer opposite the first side, wherein the emergent light originates from the broadband light source; and a detector module configured to analyze the reflected light and the emergent light to identify wafer defects.
Claims20
A system, comprising:
- a broadband light source;
- a wafer with a first side facing the broadband light source;
- a first light sensor configured to detect reflected light from the broadband light source emanating from the first side;
- a second light sensor configured to detect emergent light emanating from a second side of the wafer opposite the first side, wherein the emergent light originates from the broadband light source;
- and
- a detector module configured to analyze the reflected light and the emergent light to identify wafer defects.
A system, comprising:
- a broadband light source;
- a wafer with a first side facing the broadband light source;
- a first light sensor configured to detect reflected light from the broadband light source emanating from the first side;
- a second light sensor configured to detect emergent light emanating from a second side of the wafer opposite the first side, wherein the emergent light originates from the broadband light source;
- and
- a detector module configured to generate a three dimensional map of wafer defects based on the reflected light and the emergent light.
A method, comprising:
- radiating a broadband light onto a first surface of the wafer;
- collecting first light sensor data from reflected light off of the first surface;
- collecting second light sensor data from emergent light emerging from a second surface of the wafer opposite the first surface of the wafer;
- detecting wafer defects based on the reflected light and the emergent light.
Dependencies are inferred from the claim text.