Position detecting device, and method of manufacturing position detecting device

A method of manufacturing a position detecting device configured to detect a position of a detection target, the position detecting device including:

• an IC package including
• a first magnetic detection element configured to output a signal that depends on a first component of an ambient magnetic field or a strength of the first component,
• a second magnetic detection element configured to output a signal that depends on a second component of the ambient magnetic field different from the first component or a strength of the second component,
• a sealing portion in which the first magnetic detection element and the second magnetic detection element are sealed,
• a first lead line that projects in a first direction from the sealing portion to output therethrough a first signal output by the first magnetic detection element to an outside,
• a ground lead line that projects in the first direction from the sealing portion to cause a current that has flowed through the first magnetic detection element and the second magnetic detection element to flow therethrough to a ground,
• a power supply lead line that projects in the first direction from the sealing portion to cause a current to flow therethrough toward the first magnetic detection element and the second magnetic detection element, and
• a second lead line that projects in the first direction from the sealing portion to output therethrough a second signal output by the second magnetic detection element to the outside, the ground lead line and the power supply lead line provided between the first lead line and the second lead line;
• a first terminal line extending in a direction opposite to the first direction from a first connection portion electrically connectable to the first lead line;
• a ground terminal line including a ground connection portion, which is electrically connectable to the ground lead line, and a bypass portion, which extends in a direction different from the first direction, the bypass portion being connected to an end of the ground connection portion in the first direction;
• a power supply terminal line extending in the direction opposite to the first direction from a power supply connection portion electrically connectable to the power supply lead line;
• a second terminal line extending in the direction opposite to the first direction from a second connection portion electrically connectable to the second lead line,
• a bypass terminal line positioned on an opposite side of the ground terminal line across the first terminal line or the second terminal line and connected to the bypass portion,
• motor terminal lines having one end portions electrically connected to a motor to supply electric power therethrough to the motor to rotate the detection target, and
• a connector portion, wherein in the connector portion,
• other end portions of the motor terminal line,
• an end portion of the bypass terminal line opposite to a side connected to the bypass portion,
• an end portion of the second terminal line opposite to the second connection portion,
• an end portion of the power supply terminal line opposite to the power supply connection portion, and
• an end portion of the first terminal line opposite to the first connection portion are placed in this order,
• the method comprising:
• integrally molding, in a terminal original form molding process, as an original form of a sensor terminal,
• a portion that is to become the first connection portion of the first terminal line,
• a portion that is to become the ground connection portion of the ground terminal line,
• a portion that is to become the power supply connection portion of the power supply terminal line,
• a portion that is to become the second connection portion of the second terminal line,
• a portion that is to become the bypass terminal line, and
• a die bar,
• such that the die bar is connected to, on a side of the portion that is to become the ground connection portion in the first direction,
• the portion that is to become the first connection portion,
• the portion that is to become the ground connection portion,
• the portion that is to become the power supply connection portion,
• the portion that is to become the second connection portion, and
• the portion that is to become the bypass terminal line;
• and
• cutting off, in a cutting process after the terminal original form molding process,
• the portion that is to become the first connection portion from the die bar,
• the portion that is to become the power supply connection portion from the die bar, and
• the portion that is to become the second connection portion from the die bar.

A position detecting device configured to detect a position of a detection target, comprising:

• an IC package including
• a magnetic detection element configured to output a signal that depends on one component of an ambient magnetic field or a strength of the one component,
• a sealing portion in which the magnetic detection element is sealed,
• a signal lead line that projects in a first direction from the sealing portion to output the signal output by the magnetic detection element therethrough to an outside,
• a ground lead line that projects in the first direction from the sealing portion to cause a current that has flowed through the magnetic detection element to flow therethrough to a ground,
• a power supply lead line that projects in the first direction from the sealing portion to cause a current to flow toward the magnetic detection element, and
• a dummy lead line that projects in the first direction from the sealing portion, wherein the dummy lead line is not electrically connected to the magnetic detection element, wherein the ground lead line and the power supply lead line are provided between the signal lead line and the dummy lead line;
• a signal terminal line extending in a direction opposite to the first direction from a first connection portion electrically connectable to the signal lead line;
• a ground terminal line including
• a ground connection portion electrically connectable to the ground lead line and
• a bypass portion extending in a direction different from the first direction and connected to an end of the ground connection portion in the first direction;
• a power supply terminal line extending in the direction opposite to the first direction from a power supply connection portion electrically connectable to the power supply lead line;
• a dummy terminal line provided on an opposite side of the signal terminal line across the ground terminal line and extending in the direction opposite to the first direction from a dummy connection portion connectable to the bypass portion and the dummy lead line;
• motor terminal lines having one end portions electrically connected to a motor to supply electric power therethrough to the motor to rotate the detection target;
• and
• a connector portion, wherein
• in the connector portion,
• other end portions of the motor terminal lines,
• an end portion of the dummy terminal line opposite to a side connected to the bypass portion,
• one of an end portion of the power supply terminal line opposite to a side connected to the power supply connection portion and an end portion of the ground terminal line opposite to a side connected to the bypass portion,
• the other of the end portion of the power supply terminal line opposite to the side connected to the power supply connection portion and the end portion of the ground terminal line opposite to the side connected to the bypass portion, and
• an end portion of the signal terminal line opposite to a side connected to the signal connection portion are placed in this order.

A method of manufacturing a position detecting device configured to detect a position of a detection target, the position detecting device including:

• an IC package including
• a magnetic detection element configured to output a signal that depends on one component of an ambient magnetic field or a strength of the one component,
• a sealing portion in which the magnetic detection element is sealed,
• a signal lead line that projects in a first direction from the sealing portion to output the signal output by the magnetic detection element therethrough to an outside,
• a ground lead line that projects in the first direction from the sealing portion to cause a current that has flowed through the magnetic detection element to flow therethrough to a ground,
• a power supply lead line that projects in the first direction from the sealing portion to cause a current to flow toward the magnetic detection element, and
• a dummy lead line that projects in the first direction from the sealing portion, wherein the dummy lead line is not electrically connected to the magnetic detection element, wherein the ground lead line and the power supply lead line are provided between the signal lead line and the dummy lead line;
• a signal terminal line extending in a direction opposite to the first direction from a signal connection portion electrically connectable to the signal lead line;
• a ground terminal line including a ground connection portion, which is electrically connectable to the ground lead line, and a bypass portion, which extends in a direction different from the first direction and is connected to an end of the ground connection portion in the first direction;
• a power supply terminal line extending in the direction opposite to the first direction from a power supply connection portion electrically connectable to the power supply lead line;
• a dummy terminal line provided on an opposite side of the signal terminal line across the ground terminal line, the dummy terminal line extending in the direction opposite to the first direction from a dummy connection portion connectable to the bypass portion and the dummy lead line;
• motor terminal lines having one end portions electrically connected to a motor to supply electric power therethrough to the motor to rotate the detection target;
• and
• a connector portion, wherein
• in the connector portion,
• other end portions of the motor terminal lines,
• an end portion of the dummy terminal line opposite to a side connected to the bypass portion,
• one of an end portion of the power supply terminal line opposite to a side connected to the power supply connection portion and an end portion of the ground terminal line opposite to a side connected to the bypass portion,
• the other of the end portion of the power supply terminal line opposite to the side connected to the power supply connection portion and the end portion of the ground terminal line opposite to the side connected to the bypass portion, and
• an end portion of the signal terminal line opposite to a side connected to the signal connection portion are placed in this order, the method comprising:
• integrally molding, in a terminal original form molding process, as an original form of a sensor terminal,
• a portion that is to become the signal connection portion of the signal terminal line,
• a portion that is to become the ground connection portion of the ground terminal line,
• a portion that is to become the power supply connection portion of the power supply terminal line,
• a portion that is to become the dummy connection portion of the dummy terminal line, and
• a die bar,
• such that the die bar is connected to, on one side of the portion that is to become the ground connection portion in the first direction,
• the portion that is to become the signal connection portion,
• the portion that is to become the ground connection portion,
• the portion that is to become the power supply connection portion, and
• the portion that is to become the dummy connection portion;
• and
• cutting off, in a cutting process after the terminal original form molding process,
• the portion that is to become the signal connection portion from the die bar and
• the portion that is to become the power supply connection portion from the die bar.