Device for automatically and quickly detecting two-dimensional morphology of wafer substrate in real time

Abstract

Disclosed is an apparatus for automatically and quickly detecting a two-dimensional morphology of a wafer substrate in real time. The apparatus may comprise: a first calculation module, a second calculation module and an analysis module, wherein the first calculation module calculates a curvature CX between any two points of incidence on the wafer substrate in an X direction of a substrate to be detected according to position signals of N light spots; the second calculation module calculates a curvature CY of any point of incidence on the wafer substrate in a moving direction, i.e., a Y direction of the substrate to be detected according to the position signals of the N light spots, wherein N is a natural number of 3 or more, and the N light spots are formed by N laser beams which are incident on the wafer substrate in a radial direction, i.e., the X direction, of the wafer substrate, and then respectively reflected onto PSDs (Position Sensitive Device) which correspond to incident light beams one to one; and the analysis module obtains the two-dimensional morphology of the substrate according to calculation results of the respective CX and CY. The apparatus is capable of being adaptable to a sapphire substrate on a graphite disc which rotates at a high speed.

Dependencies are inferred from the claim text.