Anisotropic Flexible Thermal Interface Pad and Method for Fabricating the Same

Abstract

In an anisotropic flexible thermal interface pad, a heat-conduction layer on a dielectric layer is formed by using electroflocking to attach a plurality of thermally-conductive fibers, such as carbon fibers, on the dielectric layer and sealing the fibers with a sealing agent, such as silicone. The sealing agent is less thermally-conductive than the fibers. The plurality of fibers is aligned substantially-unidirectionally to achieve a predetermined inclination angle (e.g., 90°) with respect to the dielectric layer for discouraging neighboring fibers to contact each other while maintaining efficient heat transmission along each fiber. Thus, heat is transmitted more efficiently along a direction perpendicular to the dielectric layer than along another direction in parallel thereto. The pad may include additional heat-conduction layers, each configured similar to the heat-conduction layer, stacked together thereon. Fibers in two neighboring heat-conduction layers are interconnected by partial overlapping to facilitate heat transfer between the two neighboring layers.

Dependencies are inferred from the claim text.