Led lighting device and method for manufacturing led lighting device

An LED lighting device comprising:

• a plurality of light emitting elements;
• a rectangular mounted substrate on which the plurality of light emitting elements are mounted;
• and
• a pair of wiring substrates located at opposing corners on the mounted substrate, each of the pair of wiring substrates comprising an electrode portion configured to supply a current to the light emitting elements from outside the LED lighting device,
• wherein on an upper surface of the mounted substrate, the mounted substrate comprises:
• a light emitting region in which the plurality of light emitting elements are mounted;
• an exposed region which is located on an outer side of the light emitting region and through which the upper surface of the mounted substrate is exposed;
• and a pair of wiring regions which are located on the outer side of the light emitting region and in which the pair of wiring substrates are located,
• wherein the light emitting region is located at a center portion of the upper surface of the mounted substrate and is partitioned from the exposed region and the pair of wiring regions by an approximately circular partition frame,
• wherein the partition frame is located on the mounted substrate and comprises portions that step over the pair of wiring substrates, and
• wherein at the portions, the plurality of light emitting elements are connected to the electrode portion of each of the pair of wiring substrates.

An LED lighting device comprising:

• a plurality of light emitting elements;
• a rectangular mounted substrate on which the plurality of light emitting elements are mounted;
• and
• a pair of wiring substrates located at opposing corners on the mounted substrate, each of the pair of wiring substrates comprising an electrode portion configured to supply a current to the light emitting elements from outside the LED lighting device,
• wherein on an upper surface of the mounted substrate, the mounted substrate comprises:
• a light emitting region in which the plurality of light emitting elements are mounted;
• an exposed region which is located on an outer side of the light emitting region and through which the upper surface of the mounted substrate is exposed;
• and a pair of wiring regions which are located on the outer side of the light emitting region and in which the pair of wiring substrates are located,
• wherein the light emitting region is located at a center portion of the upper surface of the mounted substrate and is partitioned from the exposed region and the pair of wiring regions by an approximately circular partition frame,
• wherein the partition frame is located on the mounted substrate with portions of the partition frame located along inner surfaces of the pair of wiring substrates, and
• wherein the plurality of light emitting elements are connected to the electrode portion of each of the pair of wiring substrates.