Anode unit of electroplating apparatus, electroplating apparatus including anode unit, and method for adjusting power feeding position to anode

An anode unit for an electroplating apparatus, the anode unit comprising:

• an anode;
• a power feeding element fixed to the anode, the power feeding element being configured to supply an electric power from a power supply to the anode, the power feeding element having a plurality of through-holes;
• a plurality of fixtures inserted into the through-holes on the power feeding element, the plurality of fixtures fixing the power feeding element to the anode;
• and
• a plurality of spacers disposed between the anode and the power feeding element, the plurality of spacers being mounted to the respective fixtures, wherein
• at least one of the fixtures has an insulating property, and
• at least one of the spacers mounted to the insulating fixture has an insulating property.

A method for adjusting a power feeding position to an anode by a power feeding element having a plurality of through-holes, wherein

• the power feeding element is fixed to the anode using:
• a fixture inserted into the through-hole;
• and
• a spacer disposed between the anode and the power feeding element, the spacer being mounted to the fixture, the method comprising:
• configuring the fixture at a position where a power feeding is undesired and the spacer mounted to the fixture at the position where the power feeding is undesired so as to have insulating properties;
• and
• configuring the fixture at a position where the power feeding is desired and/or the spacer mounted to the fixture at the position where the power feeding is undesired so as to have conductive properties.