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US 2019/0161878 A1Published application
Leveling agent and electroplating composition comprising the same
AssigneeSoulbrain Co., Ltd.
InventorsMin Jung JANG, Jong Cheol YUN, Wan Joong KIM, Hee Jeong RYU, Seung Min PARK
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Abstract
The present invention relates to a leveling agent and electroplating composition comprising the same. When features are plated using the electroplating composition of the present invention, excellently leveled plated surfaces with minimized defects may be obtained.
Claims8
A leveling agent comprising a compound expressed in Chemical Formula 1, as follows:
- In Chemical Formula 1,
- R1 and R2 are groups which are the same as or different from each other, each of which is independently selected from a group of hydrogen, halogens, and C1 to C10 alkyls, and which may form a fused ring by being combined with each other;
- and
- R3 is a group selected from hydrogen and C1 to C10 alkyls.
1 more element
Dependencies are inferred from the claim text.