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US 2019/0161877 A1Published application
Leveling agent and copper plating composition comprising the same
AssigneeSoulbrain Co., Ltd.
InventorsJong Cheol YUN, Wan Joong KIM, Hee Jeong RYU
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Abstract
The present invention relates to a additives for electroplating and a copper plating composition comprising the same. Excellently smooth plated surfaces with minimized defects can be obtained when a feature formed on a substrate are plated by using the copper plating composition.
Claims11
A leveling agent comprising a thioamide compound that comprises at least one of a homocyclic aromatic ring and a heterocyclic aromatic ring.
Dependencies are inferred from the claim text.