Semiconductor Device Cleaning Solution, Method of Use, and Method of Manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPinlei Edmund Chu, Chun-Wei Hsu, Ling-Fu Nieh, Chi-Jen Liu, Liang-Guang Chen, Yi-Sheng Lin
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Abstract
A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.
Claims20
A method for cleaning a semiconductor device, the method comprising:
- polishing a material away from a first surface of a semiconductor device;
- and
- cleaning the first surface with a cleaning solution, the cleaning solution comprising a host having at least one ring, the host having a hydrophilic exterior, and the host having a hydrophobic interior.
A method of manufacturing a semiconductor device, the method comprising:
- bonding an inhibitor to a conductive material atom disposed on the surface of the semiconductor device;
- reacting a chelator molecule with the conductive material atom to remove the inhibitor from the surface of the semiconductor device;
- and
- encapsulating the inhibitor with an encapsulant.
A chemical mechanical polishing cleaning solution comprising:
- a chelator;
- and
- a plurality of carrier molecules comprising ring-shaped molecules having a hydrophilic exterior and a hydrophobic interior.
Dependencies are inferred from the claim text.