Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition
AssigneeHitachi Chemical Company, Ltd.
InventorsYuya HIRAYAMA, Takayo KITAJIMA, Kenichi TOMIOKA, Keisuke KUSHIDA, Minoru KAKITANI, Hiroshi SHIMIZU
Life of this patent
Estimating the term…
Abstract
The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.
Claims16
A resin composition comprising an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.
A method for producing a resin composition including an acrylic polymer (A) and a thermosetting resin (B), the method comprising the following Steps 1 to 4:
- Step 1:
- a step of determining a storage elastic modulus of a cured material of a desired resin composition;
- Step 2:
- a step of specifying an absolute value X of a difference between a solubility parameter (SP value) of the acrylic polymer (A) and a solubility parameter (SP value) of the thermosetting resin (B) on a basis of a correlation between the absolute value X and the storage elastic modulus of the cured material;
- Step 3:
- a step of selecting the acrylic polymer (A) and the thermosetting resin (B) so as to take the absolute value X as specified in the Step 2;
- and
- Step 4:
- a step of mixing the acrylic polymer (A) and the thermosetting resin (B) as selected in the Step 3.
A method for producing a resin composition including an acrylic polymer (A) and a thermosetting resin (B), the method comprising the following Steps 1 to 4:
- Step 1:
- a step of determining heat resistance of a cured material of a desired resin composition;
- Step 2:
- a step of specifying an absolute value X of a difference between a solubility parameter (SP value) of the acrylic polymer (A) and a solubility parameter (SP value) of the thermosetting resin (B) on a basis of a correlation between the absolute value X and the heat resistance of the cured material;
- Step 3:
- a step of selecting the acrylic polymer (A) and the thermosetting resin (B) so as to take the absolute value X specified in the Step 2;
- and
- Step 4:
- a step of mixing the acrylic polymer (A) and the thermosetting resin (B) as selected in the Step 3.
Dependencies are inferred from the claim text.