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US 2019/0161580 A1Published application
Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component
AssigneeHitachi Chemical Dupont Microsystems, Ltd.
InventorsAyaka AZUMA, Satoshi ABE, Kazuya SOEJIMA, Masato NISHIMURA, Tadamitsu NAKAMURA
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Abstract
Provided is a photosensitive resin composition containing; (A) a polymer having an acidic functional group or a substituent derived therefrom; (B) a photoreactive compound; (C) a solvent; and (D) a nitrogen-containing aromatic compound represented by the following general formula (1).
Claims9
A photosensitive resin composition, comprising:
- (A) a polymer having an acidic functional group or a substituent derived therefrom;
- (B) a photoreactive compound;
- (C) a solvent;
- and
- (D) a nitrogen-containing aromatic compound represented by the following general formula (1):
- (wherein, R1 is a hydrogen atom or a hydrocarbon group, R2 is a hydrogen atom, an amino group, an alkyl group, an alkenyl group, a cyclic aliphatic group having 3 to 10 carbon atoms or a phenyl group, and A, B, and E are each independently N or CR3;
- R3 is a hydrogen atom or a monovalent organic group;
- and when a plurality of R3 exist, the plurality of R3 may be identical to or different from each other.).
5 more elements
Dependencies are inferred from the claim text.