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US 2019/0161347 A1Published application
Method for manufacturing a micromechanical sensor
AssigneeRobert Bosch GmbH
InventorJohannes Classen
Life of this patent
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Abstract
A method for manufacturing a micromechanical sensor, including the steps: providing a MEMS wafer that includes a MEMS substrate, a defined number of etching trenches being formed in the MEMS substrate in a diaphragm area, the diaphragm area being formed in a first silicon layer that is situated at a defined distance from the MEMS substrate; providing a cap wafer; bonding the MEMS wafer to the cap wafer; and forming a media access point to the diaphragm area by grinding the MEMS substrate.
Claims10
1-9. (canceled)
A method for manufacturing a micromechanical sensor, comprising:
- providing a MEMS wafer that includes a MEMS substrate, a defined number of etching trenches being formed in the MEMS substrate in a diaphragm area, the diaphragm area being formed in a first silicon layer situated at a defined distance from the MEMS substrate;
- providing a cap wafer;
- bonding the MEMS wafer to the cap wafer;
- and
- forming a media access point to the diaphragm area by grinding the MEMS substrate.
2 more elements
A micromechanical sensor element, comprising:
- a MEMS wafer that includes a MEMS substrate, a defined number of etching trenches being formed in the MEMS substrate in a diaphragm area, the diaphragm area being formed in a first silicon layer situated at a defined distance from the MEMS substrate;
- a cap wafer, wherein the MEMS wafer is bonded to the cap wafer;
- and
- a media access point to the diaphragm area formed by grinding the MEMS substrate.
1 more element
Dependencies are inferred from the claim text.