Systems and methods for temperature sensor access in die stacks
AssigneeMicron Technology, Inc.
InventorGary L. Howe
Life of this patent
Estimating the term…
Abstract
A memory device may include a memory array including a plurality of memory cells and a die stack including at least a portion of the plurality of memory cells. The memory device may also include multiple temperature sensors each designed to output a temperature code corresponding to the temperature of a respective die of the die stack. One die of the die stack is then designed to output the temperature code corresponding to the hottest die of the die stack.
Claims22
A memory device comprising:
- a memory array comprising a plurality of memory cells;
- a die stack comprising at least a portion of the plurality of memory cells;
- and
- a plurality of temperature sensors each configured to output a temperature code corresponding to the temperature of a respective die of the die stack, wherein one die of the die stack is configured to output the temperature code corresponding to the hottest die of the die stack.
The memory device of claim 9, wherein the mode register is configured to be read and output the temperature code of the hottest die of the die stack for use in designating a refresh rate of the memory device.
The memory device of claim 10, wherein if the temperature code of the hottest die of the die stack is representative of a temperature higher than a threshold temperature, the refresh rate of the memory device is increased.
A system comprising:
- a controller;
- and
- a memory device communicatively coupled to the controller, wherein the memory device comprises a die stack comprising a plurality of die, wherein each of the plurality of die comprises:
- a temperature sensor configured to output temperature codes corresponding to the temperature of the die;
- and
- compare logic configured to compare the temperature code of the die to the temperature code of an adjacent die of the die stack and to output the temperature code indicative of a higher temperature.
A method, comprising:
- receiving, from temperature sensors, a plurality of temperature codes, wherein each of the plurality of temperature codes corresponds to a temperature of a die in a die stack of a memory device;
- comparing, using compare logic, two or more of the plurality of temperature codes to determine a die having the highest temperature;
- and
- repeating the comparing until the hottest die of the die stack is determined.
Dependencies are inferred from the claim text.