Sensor assembly and arrangement and method for manufacturing a sensor assembly
AssigneeSciosense B.V.
InventorsHarald Etschmaier, Anderson Singulani
Life of this patent
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Abstract
A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.
Claims15
A sensor assembly for being mounted on a circuit board, the sensor assembly comprising
- an interposer with
- a first main surface, a second main surface opposite to the first main surface and at least one opening extending between the first and the second main surface;
- and
- at least two stress decoupling elements, wherein each of the at least two stress decoupling elements comprises a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening;
- a sensor die connected to the flexible structures on the first main surface;
- and
- at least two board connection elements adapted for connecting the sensor assembly to the circuit board, the at least two board connection elements being arranged on the first main surface.
A method for manufacturing a sensor assembly for being mounted on a circuit board, the method comprising
- providing an interposer with a first main surface and a second main surface opposite to the first main surface;
- generating at least one opening extending between the first and the second main surface, thereby forming at least two stress decoupling elements, each of the at least two stress decoupling elements comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening;
- attaching at least two board connection elements to the first main surface, the at least two board connection elements being adapted for connecting the sensor assembly to the circuit board;
- providing a sensor die and connecting the sensor die to the flexible structures on the first main surface.
Dependencies are inferred from the claim text.